Other Electronic Components

2*32 male
It is Q type straight male
The position is 64 pins
The color is white
The pitch is 2.54mm*2.54mm...

CTS series are high-precision current transformers, they are manufactured strictly under the instruction of "a current transformer" patent technology.

2EDGKBM screw terminal block
Pitch:5.0/5.08mm
color:green/black/blue/white or customized
Terminal block:Brass,Tin plated

Multi Layer MCPCB Product Parameters
•4 layers Aluminum Core PCB
•4 layer trace on the same side
•1.6mm board thickness
•1OZ copper thickne

Our devices offer solutions for noise, space and security concerns, data center control, information distribution, conference room presentation, etc.

MCPCB Product Parameters
•1 Lay Aluminum Core PCB
•Special 1.8mm thickness
•1OZ copper
•Thermal conductivity: 1W/m-K...

led push button switch
1.Full color LED illuminated
2.Long electrical Life Cycles
3.SPST,Momentary
4.Life:5,000,000 cycles

Dengfeng Jinyu Thermoelectric Material Co., Ltd. is local leading manufacturer of silicon carbide (SiC) heating elements and molybdenum disilicide .

1.Pin header 1012A-01A its pitch is 2.54mm.
2.it is straight angle.it could be cut into different pins .
3.there are normal and gold plated .

1. PCB terminal block 635
2.Pitch 6.35mm
3.We often produce 2pole and 3 pole .
4. Color is green.
5. We got CE ,UL , VDE .

1.Screw terminal block 300R
2.its pitch is 5.0mm
3.there are ROHS or not . it got UL, CE .
4.It is right Angle .
5. blue color.

1.Pitch:5.0mm
2.Pin header:Brass,Tin plated
3.Housing:PA66, UL94V-0
4.Rated Voltage:300V
5.Rated Current:15A...

Multi-pin seals for connector . Our products have a good sealing and insulation resistance.They are widely used in military products.

The term "hybrid package" or "microelectronic package" refers to the hermetically sealed packaging of encapsulated and non-encapsulated components

The term "hybrid package" or "microelectronic package" refers to the hermetically sealed packaging of encapsulated and non-encapsulated components

The term "hybrid package" or "microelectronic package" refers to the hermetically sealed packaging of encapsulated and non-encapsulated components

The term "hybrid package" or "microelectronic package" refers to the hermetically sealed packaging of encapsulated and non-encapsulated components

The term "hybrid package" or "microelectronic package" refers to the hermetically sealed packaging of encapsulated and non-encapsulated components

The term "hybrid package" or "microelectronic package" refers to the hermetically sealed packaging of encapsulated and non-encapsulated components

1Data comunication
2Microwave packaging
3Industrial lasers
4Medical technology
5Sensor technology...