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Metallic Processing Machinery

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    Double side grinding machine double lapping for metal alloy ceramic silicon wafer sapphire parts surface grinding
    Double side grinding machine double lapping for metal alloy ceramic silicon wafer sapphire parts surface grinding
    Unit Price: 50000.0~150000.0 USD
    Min.Order: 1 Set/Sets

    double side grinding/lapping machines, for flat parts grinding. Automatic/semi-automatic types under choices, customized according to workpiece data

    Beijing Kai Shuo Heng Sheng Technology Co., Ltd.

    [Manufacturer, Trading Company]

    cn China (Mainland)
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