6 layers pcb

2 Layer PCB For LED
1.LED PCB
2.Double sided pcb
3.FR4
4.Competitive price

1.Surface Finished:ENIG
2.Depth Routing for alternative Rigid-Flex solution, Remainding thickness is Matte green soldermask IPC 6012C Class II

1.Surface Finished:ENIG
2.Fine Pitch BGA design with balll pad diameter 0.25mm; Casstellation Holes (Half PTH) design Bluetooth module

1.Surface Finished:Immersion Au + Carbon
2.Materials:Normal Tg130 FR4 ITEQ IT140
3.PTF design Black solder mask IPC 6012C Class II

1.Min Laser Hole:0.1mm
2.HDI:1+4+1 structure
3.Impedance Tolerance:Single Edge and Differential Pair +/-10%ohms
4.Immersion Gold
5.Master board

1.Min Laser Hole:0.1mm
2.HDI:1+1+6+1+1
3.Single Edge and Differential Pair +/-10%ohms
4.Surface Finished:ENIG
5.Cell phone master

1.Min Laser Hole:0.13mm
2.HDI:1+6+1
3.Surface Finished:Immersion Gold
4.High densitive interconnection design
5.Automotive application

1.BGA design
2.Master Board Automotive Application
3.Taiyo PSR4000 Soldermask
3.Surface Finished:Thick Immersion Tin >=1.2um

1.Min Laser Hole:0.1mm
2.HDI:2+2+2 structure
3.Impedance Tolerance:Single Edge and Differential Pair +/-10%ohms
4.Immersion Gold
5.Camera Applying

1.Surface Finished:ENIG
2.Fine Pitch BGA design with balll pad diameter 0.3mm
3.Four sides Casstellation Holes (Half PTH) design
4.Wire less modu

Product Description
Board Size : 228.60mmx127.00mm - Thickness : 2.4mm +/-10% - Material : Isola 370HR - Minimum Drilling size : 0.2mm - Via Densit

NO ITEM Technical capabilities
1 Layers 1- 20 layers
2 Max Board Size 610x610mm
3 Min Board Thickness 2 layers - 8mil (0.2mm)
4 4 layers - 16mil

Production Model: 02R00230 Layer: 2 Layers Process: Lead-free HASL Finished Thickness: 1.6mm Special Show: plane around the obstructing Around line

Layer: 4 layers
Process: Immersion Gold
Special Show:
1. Blind Via: L1-L2,L3-L4
2. Min Outer Lay

1.Surface Finished:ENIG
2.Materials:Middle Tg150 FR4 ITEQ IT158
3.Power Application
4.IPC Class 3 Requirement1

1.Surface Finished:Immersion Gold Ni>=120U"; Au>=3U"
2.Materials:High Tg170 FR4 ITEQ IT180
3.Prepreg 2116

1.BGA design
2.Master Board Automotive Application
3.Taiyo PSR4000 Soldermask
3.Surface Finished:ENIG

1.VIP design (via in pad and filled with epoxy material)
2.Countersink design
3.Surface Finished:ENIG

1.Surface Finished:OSP
2.Halogen Free Solder Mask
3.Automotive Application

1.Surface Finished:Immersion Au + PTF Design
2.Red solder mask
3.IPC 6012C Class II

1.Surface Finished:Immersion Au + PTF Design
2.White solder mask
3.IPC 6012C Class II

1.Application for Auto-Line Production
2.Material: CEM1
3.Surface Finished:OSP

6 layers rigid-flexible PCB
Board thickness: 0.60MM
Copper thickness: 0.5oz
Minimum line width/space: 3/3mils
Minimum drilled hole diameter: 0.10

4 layers PCB with edge plated
Board thickness: 1.20MM
Copper thickness: 1oz
Minimum line width/space: 6/6mils
Minimum drilled hole diameter: 0.3

 
Custom 8 layer High TG HDI PCB Prototyping For Mobile Testing
 
 
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Material:FR-4 1.6mm,1OZ copper for each layer
Surface finish: Immersion Gold
Minimum trace width/spacing:5/5mils
Minimum hole Dia.:0.3mm
Character

Minimum line width/space: 4mils
Surface finish: immersion gold
Board thickness: 1.60MM
Minimum drilled hole diameter: 10mils
Copper thickness: 0.5

 
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fr4 double layer pcb China, manufacturers, suppliers, factory, wholesale, customized, brands, buy, cheap, discount, bulk, in stock, free sample

FR4 pcb, immersion gold pcb, 4-layer pcb board
1.High precision,100% test
2.HASL,OSP,immersion gold
3.UL,ROHS,ISO9001
4.No MOQ request.