SiO2 Purity: 99.95% min.
Size: D50, 0.5um-10um per the user's demands.
Capacity:3000MT a year
Features:
1.mono-dispersed,
2.surface smoothness,
3.good fluidity,
4.low coefficient of thermal expansion
5.high fill rate
Our silica does not contain any detectable amount of RoHS elements. Furthermore, we are fully prepared to work with our customers for customization (including particle size) and surface treatment of these particles to optimize their application.
Spherical Fused Silica, is widely used in the electronic industry in circuit boards and semiconductor devices due to its properties of good abrasion resistance, electrical insulation and high thermal stability.
Applications: electronic packaging, chip packaging, photovoltaic cell chip packaging, special engineering plastic products, inks, paints, pigments, daily chemical products and so on.
best regards
Angel
email:oyyj(AT)sinosi.org
cell phone:18683551282
