Ceramic-based Copper Clad laminate is made of ceramic, resin and copper foil.
Advantage: Better mechanical strength;High anti-stripping strength;Outstanding high-frequency Excellent Thermal Conductivity; Excellent stability for the cycle of high and low temperature;
Coefficient of thermal expansion close to silicon chips.no need the transit layer as assembling and
apply for the COB. Without any Pollution.
Peel Strength (Min): ≥1.8 N/mm.
Break-down Voltage(Min): >20 KV.
Heat Resistance: ≤1.1 ℃/W
Dielectric Constant (Max)1MHz:≤8.5
Advantage: Better mechanical strength;High anti-stripping strength;Outstanding high-frequency Excellent Thermal Conductivity; Excellent stability for the cycle of high and low temperature;
Coefficient of thermal expansion close to silicon chips.no need the transit layer as assembling and
apply for the COB. Without any Pollution.
Peel Strength (Min): ≥1.8 N/mm.
Break-down Voltage(Min): >20 KV.
Heat Resistance: ≤1.1 ℃/W
Dielectric Constant (Max)1MHz:≤8.5
