Black Semi - Conductive HIPS Sheet Used for Microcontroller Chip Packages

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Black Semi - Conductive HIPS Sheet Used for Microcontroller Chip Packages

 

Product Description:

Specifications

Data

Units

Thickness

1.8

mm

Width

680

mm

Density

1.05

g/cm³

Impact Strength

≥ 28

mpa

Vicat Softening Temp

≥ 88

°

Tensile elongation at break

50

%

Tensile yield strength

≥ 25

mpa

Surface Resistivity

10~ 107

Ω

Flammability Rating

UL94

H-B

Customized Color

Black color 

Feature

 

  Semi - Conductive HIPS Sheet in Roll ( 10~ 107Ω )

  1. It’s basically not influenced by the temperature and relative humidity. It is laminated by nano-sized & base materials and its surface is super clear.
  2. We can produce the semi-conductive function by cutting-edge embedded and coated (oily or water-based) technique to get perfect uniform conductive effect on every inch of HIPS sheet or roll.
  3.  High chemical strength, High tensile strength

     Reliable electrical insulation, Easy of processing mold

     Good heat resistance.

Material  100% virgin High Impact Polystyrene resin in particles

Application

  Applied to the Thermoforming, Extruded packaging of Electronic  trays, Hardware & Tool, Microcontroller chip tray, etc.

 

 

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Mr. David Kuang
Tel: 86-21-33896111
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Pulixin Packaging Materials (Shanghai) Co., Ltd.
No.32 Lubin Road, Luyuan Industrial Zone, Pudong, Shanghai, China (Mainland)
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