Multilayer PCB Manufacturing Process FPC Board Flexible PCB Immersion Gold Yellow

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Multilayer PCB Manufacturing Process FPC Board Flexible PCB Immersion Gold Yellow

 

  • Rigid-flex, flexible circuit
  • 1-12 layers
  • Width / space - 0,075mm single / double sided
  • Hole (mini) - drill (pth) 0,15mm / punch 0,5mm
  • Surface treatment - Ni / Au, ENIG, Tin plating
  • Peel strenght - adhesive 1,0 mil - 1,0 kg f/cm  IPC-TM 650 2.4.9

                                - adhesive 0,5 mil - 0,5 kg f/cm  IPC-TM 650 2.4.9

  • Solder float resistance - 270oC / 10 sec
  • Insulation resistance - 500 Mohm
  • Dielectric withstanding voltage - 500 V

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Tel: 86-755-29639796
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Chi Tun Electronics Company
FLAT2413 HANG CHI HOUSE CHEUNG HANG ESTATE TSINGYI TSUENWAN Hongkong, Shenzhen, Guangdong, China (Mainland)
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